 SMT
and BGA Assembly
Assembly Contracts utilizes the best technologies available for
precise, SM assembly. Pcb's can be automatically loaded, assembled,
inspected and reflow soldered under the supervision of a single
technician. QFP, TQFP, PLCC, TSSOP, SSOP, and QSOP through to the more
recent package developments of LFBGA, TFBGA, FlexBGA, and QFN can all be
accommodated.
A broad range of components can be automatically handled for speed
& efficiency whilst we also have the capability of hand placements
off-line for additional flexibility.
Solder Paste application is achieved to the highest accuracy using our
in-line solder paste printing machines.
Fiducial alignment is used to ensure repeatable results that minimise
placement failure and the associated costly rework.
Automatic optical Inspection enables us to inspect the solder fillet prior
to component placement.
Please visit our Gallery section to view
our equipment and facilities |
