|
Current lead time and pricing data for electronic components.
Last Update :
22/03/2007
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Lead Times and Pricing Trends
Summary
|
| Micro
Standard lead-time approx 12-16 wks.
Renesas 16 wks.
Maxim 20 wks.
Tosh 16 wks.
TI ahead at only 6-8 wks
|
Commodity Lin & Logic
Maxim 18 wks & Rohm 14 wks +.
STM surface mount back on alloc rest 12 wks.
Standard Lead-time approx 14-16 wks.
FSC offering around 20 wks.
TI extended 26 wks – test problems on most.
All old Burr Brown on alloc
|
Non- Commodity Lin & Logic
Standard Lin & Logic between 12-16 wks.
FSC now stable 12 wks.
TI offering 12-16 wks.
STM surface mount is on alloc rest 12 wks.
AD extended to 16 wks
|
| Memory
Standard lead-time 12-20 wks.
STM have gone from alloc to 10 wks.
BEWARE – TOSH now withdrawn. SRAM, NAND chips. |
Discretes
FSC have moved out to 22 wks.
INFN are at 12 wks.
STM surface mount is on alloc rest 12 wks.
Vishay 20 wks, some alloc.
All the rest at 12-18 wks. |
Other
FSC Opto see Everlight – 8 wks.
Vishay 20 wks, some alloc.
Tosh opto on alloc. |
Electrolytics
Standard lead-time is extending to approx.
18 wks.
Pan standard lead-time 18 wks – ask marketing for factory
improvement. |
Tantalums
Lead-times all over the place on Tants varying from
6-20 wks
Rohm no longer promoting. No quote for to new business.
Some HiCap
values are on extended leadtimes up to 20/24 wks.
Vishay 11-16 wks Kemet
6-20 wks |
Cap Ceramics
Lead-times now more under control at 8-18 wks
AVX,
Kemet & Epcos at only 8-12 wks.
The rest sit at around 12-18 wks.
Kemet &
AVX stock can be checked online, please contact us. |
| Inductors
Lead-times are extending approx. 12-16 wks.
Bourns 12 wks.
Epcos 4-15 wks, often stk 0805’s 9-12 wks.
Tyco at 12 wks.
Murata 10 wks
|
Protection
Lead-times range from 12-16 wks.
AVX & Bourns offering 12 wks.
Epcos 14 wks.
|
Resistors
Lead-times range from 6-16 wks.
Many RN73 (0805 10ppm’s) in stock, leadtime down to 6-8 wks.
Vishay CRCW series are currently 12-14 wks
|
Legend:
Increasing ↑ Stable ↔
Decreasing ↓
Last updated: 2nd March 2007
| Semiconductors - Standard Products |
|
Technology |
Supplier |
Lead Time |
Price |
Comments |
| LOGIC |
Fairchild |
↔ |
↔ |
Lead Times
8-16 wks |
| LOGIC |
NXP |
↔ |
↔ |
Lead Times
8-12 wks |
| LOGIC |
ON Semiconductor |
↔ |
↔ |
Lead Times
8-12 wks |
| LOGIC |
STMicroelectronics |
↓ |
↔ |
Lead Times
12-18 wks |
| LOGIC |
Texas Instruments |
↔ |
↔ |
Lead Times
6-12 wks |
| LINEAR |
National Semiconductor |
↔ |
↔ |
Lead Times
6-12 wks |
| LINEAR |
STMicroelectronics |
↓ |
↔ |
Lead Times
8-16 wks |
| LINEAR |
Texas Instruments |
↓ |
↔ |
Lead Times
4-8 wks |
| LINEAR |
Toshiba |
↔ |
↔ |
|
| LINEAR |
ON Semiconductor |
↔ |
↔ |
Lead Times
6-12 wks |
| LINEAR |
Vishay |
↔ |
↔ |
Lead Times
16-22 wks |
| DISCRETE |
ON Semiconductor |
↔ |
↔ |
Lead Times
8-12 wks |
| DISCRETE |
Vishay |
↔ |
↔ |
Lead Times
12 wks |
| DISCRETE |
Taiwan Semi |
↔ |
↔ |
Lead Times
12 wks |
| DISCRETE |
STMicroelectronics |
↔ |
↔ |
Lead Times
12-16 wks |
| DISCRETE |
NXP |
↔ |
↔ |
Lead Times
6-12 wks |
| POWER |
NXP |
Allocation |
↔ |
Heavy allocation |
| POWER |
STMicroelectronics |
↔ |
↑ |
Heavily constrained |
| POWER |
Vishay |
↔ |
↔ |
Lead Times
16-22 wks |
| POWER |
Fairchild |
↑ |
↔ |
Lead Times
30 wks |
| OPTOCOUPLERS |
Fairchild |
↔ |
↔ |
Lead Times
8-16 wks |
| OPTOCOUPLERS |
Sharp |
↔ |
↔ |
Lead Times
16-22 wks |
| OPTOCOUPLERS |
Toshiba |
↔ |
↔ |
Lead Times
16-22 wks |
| OPTOCOUPLERS |
Vishay |
↔ |
↔ |
Lead Times
6-8 wks |
| OPTOCOUPLERS |
Avago |
↔ |
↔ |
Lead Times
6-8 wks |
|
Supplier |
Technology |
Lead Time |
Price |
Comments |
| Atmel |
EEPROM (Serial) |
↔ |
↔ |
Serial EEPROM price stable, issues on 512k
and extending Lead Times on 16k |
| Atmel |
EEPROM (Parallel & Wireless) |
↔ |
↔ |
Price remains stable |
| Atmel |
EPROM |
↔ |
↔ |
Lead Times remain stable at between
ex-stock to 8 wks depending on density |
| Atmel |
Flash |
↓ |
↔ |
4-16 wks Lead Times no major issues |
| Cypress |
Slow SRAM |
↓ |
↓ |
Improvement in general Lead Times due to
new die and production mix. |
| Cypress |
Fast SRAM |
↔ |
↓ |
Improvement in general Lead Times due to
new die and production mix. Issues still on 2Mb and 4Mb |
| IDT |
Fast SRAM |
↔ |
↔ |
26 wks |
| Intel |
Flash |
↓ |
↔ |
4-8 wks |
| Microchip |
EEPROM |
↔ |
↔ |
Lead Times between
4-16 wks |
| Micron |
SDRAM |
↔ |
↓ |
4-6 wks |
| Micron |
DDR I and DDR II |
↔ |
↔ |
16 wks to allocation Mixed availability on
parts |
| Micron |
NAND Flash |
↔ |
↔ |
Samples and pre-production volumes only |
| NEC |
SRAM |
↔ |
↔ |
Lead Times 16 wks |
| Renesas |
SRAM |
↑ |
↔ |
Lead Times 16 wks |
| Samsung |
Fast SRAM |
↔ |
↔ |
4Mb IndTemp still ok, full production. |
| Samsung |
SDRAM |
Allocation |
↔ |
Parts on allocation upside available
dependant on density and Samsung production mix |
| Samsung |
DDR I and DDR II |
↔ |
↔ |
256Mb & 512Mb average Lead Times 4-6 wks,
1Gb 8-10 wks |
| Samsung |
NAND Flash |
↔ |
↓ |
None left on allocation, rest on average
7-9 wks. |
| Sharp |
SRAM (64k Only) |
EOL |
↑ |
On EOL now. |
| Spansion |
Flash |
↔ |
↓ |
No major supply issues Lead Times 4-16 wks
dependant on density and package |
|
STMicroelectronics |
EEPROM |
↔ |
↔ |
Lead Times now 4-16 wks |
|
STMicroelectronics |
EPROM |
↔ |
↔ |
No major supply issues Lead Times 4-16 wks
dependant on density and package |
|
STMicroelectronics |
NOR Flash |
↔ |
↔ |
Lead Times 4-16 wks no major supply issues |
|
STMicroelectronics |
NAND Flash |
↔ |
↓ |
Focus on 128Mb, 256Mb and 512Mb Joint
venture with Hynix. New for distribution customers |
| Toshiba |
SRAM |
Obsolete |
↑ |
All SRAMs which were left are EOL'd |
| Toshiba |
NAND Flash |
Allocation |
↓ |
Parts in short supply, EOL on 64Mb and
128Mb Price trends dependant on density |
| Semiconductors - Proprietary |
|
Supplier |
Technology |
Lead Time |
Price |
Comments |
| Analog Devices |
Analogue |
↔ |
↔ |
Yield issues on some specific Part
Numbers. Lead Times typically
12-16 wks overall.
Some parts on formal allocation.
Military parts 22 wks |
| Analog Devices |
DSP |
↔ |
↔ |
Yield issues on some specific Part
Numbers. Lead Times typically
12-16 wks overall.
Some parts on formal allocation |
| Altera |
FPGA |
↔ |
↔ |
Some Stratix II and Max II still on
allocation.
Lead time typically
6-12 wks |
| Atmel |
AVR-Micro's, (ATMEGA, ATTINY) |
↔ |
↔ |
AVR's 8-12 wks,
C51 core 16-18 wks |
| Cypress |
Low speed USB |
↔ |
↔ |
Lead Times 6-14 wks |
| Cypress |
HOTLinkII (parts beginning CYP, CYV, CYW) |
↔ |
↔ |
Lead Times appr.
6-8 wks |
| Cypress |
Low speed USB |
↔ |
↔ |
Lead Times appr.
18-20 wks |
| Freescale |
8-bit &16-bit Micros with embedded Flash |
↑ |
↔ |
Generally 8-bit and 16-bit Flash MCU's
Lead Times 22-26 wks due to increased demand. Improvement
expected in Q1'07 to be 14-16 wks |
| IR |
Power |
↔ |
↔ |
Capacity problems on DPAK, SO8 and D2PAK.
Lead Times 22-26 wks |
| LTC |
Data Converters |
↔ |
↔ |
Lead Times typically 4 wks |
| LTC |
Amplifiers / Comparators |
↔ |
↔ |
Lead Times typically 4 wks |
| LTC |
Power Management |
↔ |
↔ |
Lead Times typically 4 wks |
| LTC |
Interface |
↔ |
↔ |
Lead Times typically 4 wks |
| Micrel |
Ethernet (KSx) High Bandwidth (SYx) |
↔ |
↔ |
Lead Times 6-16 wks |
|
STMicroelectronics |
Regulator: Ppak and D2pak |
↑ |
↔ |
Lead Times 20 wks+ |
|
STMicroelectronics |
Rectifiers |
↑ |
↔ |
Lead Times 15-20 wks |
|
STMicroelectronics |
Protection |
↔ |
↔ |
Lead Times 11-15 wks |
Texas
Instruments |
High Performance Analogue INAx, OPAx, Ucx |
Allocation |
↔ |
Test capacity & qualifying issues. Old
legacy Burr Brown parts on formal allocation and Lead Times on
others still extended at 12-26 wks |
Texas
Instruments |
TMS320 - DSP's |
↔ |
↔ |
Lead Times are improving between 12-16 wks |
Texas
Instruments |
MSP430 - Micro's |
↔ |
↔ |
Lead Times are improving between 12-16 wks |
|
Supplier |
Technology |
Lead Time |
Price |
Comments |
| Sharp |
Displays |
Allocation |
↔ |
Extended Lead Times between 22-26 wks |
| All |
Displays |
↔ |
↔ |
General Lead Times between 12-16 wks on
Far East Suppliers. |
|
Product |
Package |
Lead Times |
Price |
Comments |
| Ceramic
Capacitors |
Surface Mount |
↔ |
↔ |
Murata high-caps extended Lead Times |
| Ceramic
Capacitors |
Leaded |
↑ |
↔ |
Lead Times 12 wks |
| Tantalum
Capacitors |
Surface Mount |
↔ |
↔ |
Kemet High-caps Lead Times up to 35 wks |
| Tantalum
Capacitors |
Leaded |
↔ |
↔ |
Lead Times 10 wks |
| Film Capacitors |
Box |
↔ |
↔ |
BCC film caps
Lead Times 22 wks |
| Electrolytic
Capacitors |
Small Can |
↓ |
↔ |
BCC Alu caps
Lead Times 22 wks |
| Electrolytic
Capacitors |
Large Can |
↓ |
↔ |
Lead Times 18 wks |
| Resistors |
Surface Mount |
↑ |
↔ |
Yageo PR/PF,RC0805,RC1206 Lead Times
increased to 15 wks |
| Resistors |
Leaded |
↔ |
↔ |
Lead Times 10 wks |
| Inductors |
|
↓ |
↔ |
Lead Times 10 wks |
| Crystals |
Surface Mount |
↔ |
↔ |
Lead Times 10 wks |
| Crystals |
Leaded |
↔ |
↔ |
Lead Times 10 wks |
| Fuses |
Standard |
↑ |
↔ |
Littelfuse parts have a general Lead Time
increase by 2 wks |
| Fuses |
Surface Mount |
↔ |
↔ |
Lead Times 10 wks |
| Fuses |
Resettable |
↑ |
↔ |
Lead Times 10 wks |
|
Supplier |
Technology |
Lead Time
Trend |
Price Trend |
Comments |
| 3M |
Headers,
IDC,
Cable/B-Board, Sockets |
↔ |
↑ |
Headers 3-8 wks
IDC 8-14 wks
Cable/B board
6-12 wks
Sockets 8 wks.
Some overdue delivery issues |
| Samtec |
Headers,
IDC,
Cable/B-Board,
Sockets |
↔ |
↑ |
Standard Lead Times
3 weeks |
| Tyco |
Headers,
IDC,
Cable/B-Board,
Sockets |
↔ |
↑ |
Headers 9-18 wks
IDC 9-18 wks
Cable/B board
9-20 wks
Sockets 12-22 wks. |
| Molex |
Headers,
IDC,
Cable/B-Board,
Sockets |
↔ |
↔ |
Headers 10-14 wks
IDC 7-15 wks
Cable/B board
11-16 wks
Sockets 8 wks.
Lead Times now stabilising. |
| FCI |
Headers,
IDC,
Cable/B-Board,
Sockets |
↑ |
↔ |
Headers 9-12 wks
IDC 10 wks
Cable/B board
8-12 wks
Sockets 10 wks. |
| FCI |
I/O,
Modular,
D-Sub |
↔ |
↔ |
I/O 5-14 wks
D-sub 10-14 wks |
| Molex |
I/O,
Modular,
D-Sub |
↔ |
↔ |
I/O 5-12 wks
D-sub 5-10 wks |
| Samtec |
I/O,
Modular,
D-Sub |
↔ |
↔ |
Standard Lead Times 3 weeks |
| Tyco |
Power,
Terminal Blocks,
Industrial |
↓ |
↑ |
Power 7-19 wks
Terminal blocks
9-20 wks
Industrial 7-16 wks. |
| Tyco |
RF Connectors |
↓ |
↑ |
18-20 wks |
| PEMCO - Electromechanical |
|
Supplier |
Technology |
Lead Time
Trend |
Price Trend |
Comments |
| Omron |
General purpose Relays
Signal
Telecom |
↔ |
↔ |
General purpose Relays /Signal / Telecom /
16 wks (may have stock at Omron, please check with Arrow) |
| Tyco |
General purpose Relays
Signal
Telecom |
↑ |
↑ |
General purpose Relays 8-24 wks
Signal and Telecom 6-18 wks.
Some Relays lead times going out 12 to 24 wks due to high
demand. |
| Fujitsu |
General purpose
PCB Relays |
↑ |
↑ |
Average lead time 14-18 wks.
Increase on FTR-B3 / B4 range also JS relays all now quoting 24
wks with possible future allocation |
| Knitter Switch |
DIL switches
Lever
Toggle
Tactile
Pushbutton |
↓ |
↔ |
DIL switches
6-7 wks
Lever / Toggle
6-14 wks
Tactile 6-8 wks
Pushbutton 6-14 wks |
| ITT Cannon |
DIL switches
Lever
Toggle
Tactile
Pushbutton |
↔ |
↔ |
DIL switches
7-14 wks
Lever
Toggle 6-15 wks
Tactile 6-8 wks
Pushbutton 6-18 wks. |
|
Supplier |
Technology |
Lead Time
Trend |
Price Trend |
Comments |
| Astec |
Power supplies
DC-DC Converters |
↑ |
↑ |
15-17 wks Lead Times. Astec have bought
Artesyn, still trading as separate names. |
| CD |
Power supplies
DC-DC Converters |
↑ |
↔ |
9-18 wks extending. Continuing extended
Lead Times |
|
| |
Legend:
Increasing ↑
Stable ↔
Decreasing ↓
Last updated: 15th
January 2007
| Semiconductors - Standard
Products |
|
Technology |
Supplier |
Lead Time |
Price |
Comments |
|
LOGIC |
Fairchild |
↓ |
↔ |
Lead Times reduced
to
8-12 wks |
|
LOGIC |
NXP |
↔ |
↔ |
Lead Times 8-12
wks |
|
LOGIC |
ON Semiconductor |
↔ |
↑ |
Lead Times 8-12
wks. Price differential on leaded Vs
RoHS compliant |
|
LOGIC |
STMicroelectronics |
↓ |
↑ |
Off formal
allocation. Lead Times 12-18 wks |
|
LOGIC |
Texas Instruments |
↔ |
↔ |
Lead Times 6-12
wks |
|
LINEAR |
National
Semiconductor |
↔ |
↔ |
|
|
LINEAR |
STMicroelectronics |
Allocation |
↔ |
Allocation but
anticipate recovery through Q1'07 |
|
LINEAR |
Texas Instruments |
↔ |
↔ |
Lead Times 6-12
wks. |
|
LINEAR |
Toshiba |
↔ |
↔ |
|
|
LINEAR |
ON
Semiconductor |
↔ |
↓ |
|
|
LINEAR |
Vishay |
↔ |
↑ |
Lead Times
22-26 wks |
|
DISCRETE |
ON
Semiconductor |
↓ |
↔ |
Lead Times
8-12 wks |
|
DISCRETE |
Vishay |
↔ |
↔ |
Lead Times
12-16 wks |
|
DISCRETE |
Taiwan Semi |
↓ |
↔ |
Lead Times
12 wks |
|
DISCRETE |
STMicroelectronics |
↔ |
↔ |
Lead Times
12-16 wks |
|
DISCRETE |
NXP |
↓ |
↔ |
Lead Times
8-12 wks |
|
POWER |
NXP |
Allocation |
↔ |
Heavy allocation |
|
POWER |
STMicroelectronics |
↔ |
↑ |
Heavily
constrained |
|
POWER |
Vishay |
↔ |
↔ |
Capacity
constrained with severe delinquencies |
|
POWER |
Fairchild |
↑ |
↔ |
Lead Times
increased to 22-26 wks |
|
OPTOCOUPLERS |
Fairchild |
↔ |
↔ |
Lead Times 8-16
wks |
|
OPTOCOUPLERS |
Sharp |
↔ |
↔ |
Lead Times 16-22
wks |
|
OPTOCOUPLERS |
Toshiba |
↔ |
↔ |
Lead Times 16-22
wks |
|
OPTOCOUPLERS |
Vishay |
↔ |
↔ |
Lead Times 16-22
wks |
|
Supplier |
Technology |
Lead Time |
Price |
Comments |
|
Atmel |
EEPROM (Serial) |
↔ |
↔ |
Serial EEPROM
price stable, issues on 512k and
extending Lead Times on 16k |
|
Atmel |
EEPROM (Parallel &
Wireless) |
↔ |
↔ |
Price remains
stable |
|
Atmel |
EPROM |
↔ |
↔ |
Lead Times remain
stable at between ex-stock to 8 wks
depending on density |
|
Atmel |
Flash |
↓ |
↔ |
Lead Times
4-16 wks |
|
Cypress |
Slow SRAM |
↓ |
↓ |
Improvement in
general Lead Times due to new die and
production mix. |
|
Cypress |
Fast SRAM |
↓ |
↑ |
Improvement in
general Lead Times due to new die and
production mix. Issues still on 2Mb and
4Mb |
|
IDT |
Fast SRAM |
↔ |
↔ |
Lead Times
26 weeks |
|
Intel |
Flash |
↓ |
↔ |
Lead Times
4-16 wk |
|
Microchip |
EEPROM |
↔ |
↔ |
Lead Times between
8-10 wks |
|
Micron |
SDRAM |
↔ |
↓ |
Lead Times
4-16 wks |
|
Micron |
DDR I and DDR II |
↔ |
↑ |
16 wks to
allocation Mixed availability on parts |
|
Micron |
NAND Flash |
↔ |
↔ |
Samples and
pre-production volumes only |
|
NEC |
SRAM |
↔ |
↑ |
Lead Times
16 wks |
|
Renesas |
SRAM |
↑ |
↑ |
Lead Times
16 wks |
|
Samsung |
Fast SRAM |
↔ |
↔ |
4Mb IndTemp still
ok, full production. 1Mb all and 4Mb
Com-temp discontinued, causing supply
issues for the rest of the market.
SyncSRAM are 12-20 wks Lead Times, RoHS
still limited availability |
|
Samsung |
SDRAM |
↔ |
↔ |
Average Lead Times
6-8 wks |
|
Samsung |
DDR I and DDR II |
↔ |
↔ |
256Mb & 512Mb
average Lead Times 4-6 wks, 1Gb 8-10 wks |
|
Samsung |
NAND Flash |
↔ |
↓ |
None left on
allocation, rest on average 7-9 wks. |
|
Sharp |
SRAM (64k Only) |
EOL |
↑ |
On EOL now. |
|
Spansion |
Flash |
↔ |
↓ |
No major supply
issues Lead Times 4-16 wks dependant on
density and package |
|
STMicroelectronics |
EEPROM |
↔ |
↔ |
Lead Times now
4-16 wks |
|
STMicroelectronics |
EPROM |
↔ |
↔ |
|
|
STMicroelectronics |
NOR Flash |
↔ |
↔ |
Lead Times 4-16
wks No major supply issues |
|
STMicroelectronics |
NAND Flash |
↔ |
↓ |
Focus on 128Mb,
256Mb and 512Mb Joint venture with
Hynix. New for distribution customers |
|
Toshiba |
SRAM |
Obsolete |
↑ |
All SRAMs which
were left are EOL'd |
|
Toshiba |
NAND Flash |
Allocation |
↓ |
Parts in short
supply, EOL on 64Mb and 128Mb Price
trends dependant on density |
| Semiconductors - Proprietary |
|
Supplier |
Technology |
Lead Time |
Price |
Comments |
|
Analog Devices |
Analogue |
↔ |
↔ |
Yield issues on
some specific Part Numbers. Lead Times
typically 12-16 wks overall. Some parts
on formal allocation. Military parts 22
wks |
|
Analog Devices |
DSP |
↔ |
↔ |
Yield issues on
some specific Part Numbers. Lead Times
typically 12-16 wks overall. Some parts
on formal allocation |
|
Altera |
FPGA |
↔ |
↔ |
Some Stratix II
and Max II still on allocation. Lead
time typically 6-12 wks |
|
Atmel |
AVR-Micro's,
(ATMEGA, ATTINY) |
↔ |
↔ |
AVR's 8-12 wks,
C51 core 16-18 wks |
|
Cypress |
Low speed USB |
↔ |
↔ |
Lead Times 6-14
wks |
|
Cypress |
HOTLinkII (parts
beginning CYP, CYV, CYW) |
↔ |
↔ |
Lead Times appr.
6-8 wks |
|
Cypress |
Low speed USB |
↔ |
↔ |
Lead Times appr.
18-20 wks |
|
Freescale |
8-bit &16-bit
Micros with embedded Flash |
↑ |
↔ |
Generally 8-bit
and 16-bit Flash MCU's Lead Times 22-26
wks due to increased deamand.
Improvement expected in Q1'07 to be
14-16 wks |
|
IR |
Power |
↔ |
↔ |
Capacity problems
on DPAK, SO8 and D2PAK. Lead Times 22-26
wks |
|
LTC |
Data Converters |
↔ |
↔ |
Lead Times
typically 4 wks |
|
LTC |
Amplifiers /
Comparators |
↔ |
↔ |
Lead Times
typically 4 wks |
|
LTC |
Power Management |
↔ |
↔ |
Lead Times
typically 4 wks |
|
LTC |
Interface |
↔ |
↔ |
Lead Times
typically 4 wks |
|
Micrel |
Ethernet (KSx)
High Bandwidth (SYx) |
↔ |
↔ |
Lead Times 6-16
wks |
|
STMicroelectronics |
Regulator: Ppak
and D2pak |
↑ |
↔ |
Lead Times 20 wks+ |
|
STMicroelectronics |
Rectifiers |
↑ |
↔ |
Lead Times 15-20
wks |
|
STMicroelectronics |
Protection |
↔ |
↔ |
Lead Times 11-15
wks |
|
Texas Instruments |
High Performance
Analogue INAx, OPAx, Ucx |
↔ |
↔ |
Test capacity &
qualifying issues. Most Lead Times
between 22-26 wks |
|
Texas Instruments |
TMS320 - DSP's |
↔ |
↔ |
Lead Times are
improving between 12-16 wks |
|
Texas Instruments |
MSP430 - Micro's |
↔ |
↔ |
Lead Times are
improving between 12-16 wks |
|
Supplier |
Technology |
Lead Time |
Price |
Comments |
|
Sharp |
Displays |
Allocation |
↔ |
Extended Lead
Times between 22-26 wks |
|
All |
Displays |
↔ |
↔ |
General Lead Times
between 12-16 wks on Far East Suppliers. |
|
Product |
Package |
Lead Times |
Price |
Comments |
|
Ceramic Capacitors |
Surface Mount |
↔ |
↔ |
Murata high-caps
extended Lead Times |
|
Ceramic Capacitors |
Leaded |
↑ |
↔ |
Lead Times
12 wks |
|
Tantalum Capacitors |
Surface Mount |
↔ |
↔ |
Kemet High-caps
Lead Times up to 35 wks |
|
Tantalum Capacitors |
Leaded |
↔ |
↔ |
Lead Times 10 wks |
|
Film Capacitors |
Box |
↔ |
↔ |
BCC filmcaps Lead
Times 22 wks |
|
Electrolytic Capacitors |
Small Can |
↓ |
↔ |
BCC Alu caps Lead
Times
22 wks |
|
Electrolytic Capacitors |
Large Can |
↓ |
↔ |
Lead Times
18 wks |
|
Resistors |
Surface Mount |
↑ |
↔ |
Yageo
PR/PF,RC0805,RC1206 Lead Times increased
to 15 wks |
|
Resistors |
Leaded |
↔ |
↔ |
Lead Times
10 wks |
|
Inductors |
|
↓ |
↔ |
Lead Times
10 wks |
|
Crystals |
Surface Mount |
↔ |
↔ |
Lead Times
10 wks |
|
Crystals |
Leaded |
↔ |
↔ |
Lead Times
10 wks |
|
Fuses |
Standard |
↑ |
↔ |
Littelfuse parts
have a general Lead Time increase by 2
wks |
|
Fuses |
Surface Mount |
↔ |
↔ |
Lead Times
10 wks |
|
Fuses |
Resettable |
↑ |
↔ |
Lead Times
10 wks |
|
Supplier |
Technology |
Lead Time Trend |
Price Trend |
Comments |
|
3M |
Headers, IDC,
Cable/B-Board, Sockets |
↔ |
↔ |
Headers 3-4 wks /
IDC 6 wks / Cable/B board 6-12 wks |
|
Samtec |
Headers, IDC,
Cable/B-Board, Sockets |
↓ |
↔ |
Standard Lead
Times 3 wks |
|
Tyco |
Headers, IDC,
Cable/B-Board, Sockets |
↑ |
↑ |
Headers 9-22 wks /
IDC 20 wks / Cable/B board 20 wks /
Sockets 20 wks. Price increase January
07 |
|
Molex |
Headers, IDC,
Cable/B-Board, Sockets |
↑ |
↑ |
Headers 9-20 wks /
IDC 9-20 wks / Cable/B board 10-12 wks
/Sockets 14 wks |
|
FCI |
Headers, IDC,
Cable/B-Board, Sockets |
↑ |
↔ |
Headers 6-9 wks /
IDC 9-19 wks / Cable/B board 8-10 wks
/Sockets 10 wks |
|
FCI |
I/O, Modular,
D-Sub |
↔ |
↔ |
I/O 5-14 wks / D
sub 10-12 wks |
|
Molex |
I/O, Modular,
D-Sub |
↑ |
↑ |
I/O 5-12 wks / D
sub 5-12 wks |
|
Samtec |
I/O, Modular,
D-Sub |
↓ |
↔ |
Standard Lead
Times 3 wks |
|
Tyco |
Power, Terminal
Blocks, Industrial |
↑ |
↑ |
Terminal blocks
9-29 wks / Industrial 12-20 wks |
|
Tyco |
RF Connectors |
↑ |
↑ |
Lead Times
9-24 wks |
| PEMCO - Electromechanical |
|
Supplier |
Technology |
Lead Time Trend |
Price Trend |
Comments |
|
Omron |
General purpose
Relays /Signal / Telecom |
↔ |
↔ |
General purpose
Relays /Signal / Telecom / 16 wks |
|
Tyco |
General purpose
Relays /Signal / Telecom |
↑ |
↑ |
General purpose
Relays 10-12 wks / Signal and Telecom
6-18 wks. Some Lead Times increased to
28 wks on 4G and IM relays possible
allocation |
|
Knitter-switch |
DIL switches /
Lever /Toggle /Tactile/ Pushbutton |
↑ |
↔ |
DIL switches 8-10
wks / Lever / Toggle 8 wks/ Tactile 6-8
wks /Pushbutton 8-24 wks |
|
ITT Cannon |
DIL switches /
Lever /Toggle /Tactile/ Pushbutton |
↔ |
↔ |
DIL switches 8 wks
/ Lever / Toggle 6-15 wks/ Tactile 6-8
wks/ Pushbutton 6-18 wks |
|
Fujitsu (Nordic only) |
General purpose
Relays |
↔ |
↔ |
General purpose
Relays 11-14 wks |
|
Supplier |
Technology |
Lead Time Trend |
Price Trend |
Comments |
|
Astec Power |
Power supplies
/DC-DC Converters |
↑ |
↑ |
8-23 wks Lead
Times |
|
C&D Technologies |
Power supplies
/DC-DC Converters |
↑ |
↔ |
10-18 wks
extending. |
|
|
Sept 2006
Click here.
June 2006
Legend:
Increasing ↑
Stable ↔
Decreasing ↓
Semiconductors - Standard Products
|
| Technology |
Supplier |
FAB
Capacity |
Lead Time |
Price |
Comments |
| LOGIC |
Fairchild |
95% |
↑ |
↑ |
Lead Times 24-30 wks. FSC booked out
for Q4. Price increases expected Q3. |
| LOGIC |
Philips |
95% |
↑ |
↑ |
Lead Times 20-30 wks. Philips added
capacity but insufficient to meet demand. Price increases
expected Q3. |
| LOGIC |
ON Semiconductor |
80% |
↔ |
↔ |
|
| LOGIC |
STMicroelectronics |
100% |
Allocation |
↑ |
Allocation. Price increases expected
Q3. |
| LOGIC |
Texas Instruments |
90% |
↑ |
↑ |
Lead Times vary from 12-26 wks. Price
increases expected Q3. |
| LINEAR |
National Semiconductor |
95% |
↔ |
↔ |
|
| LINEAR |
STMicroelectronics |
100% |
Allocation |
↑ |
Q3 allocation loaded, no opportunity
to book upside. Will definitely increase price Q3. |
| LINEAR |
Texas Instruments |
95% |
↑ |
↑ |
Lead Times vary from 18-26 wks. TLC
range just increased from 12-26 wks. Price increase expected
Q3 5%+. |
| LINEAR |
Toshiba |
80% |
↔ |
↔ |
|
| LINEAR |
ON Semiconductor |
90% |
↑ |
↑ |
Lead Times increasing. Q2 interim
price increases issued on Regulators. |
| LINEAR |
Vishay |
95% |
↑ |
↑ |
Lead Times increasing to 22-26 wks
minimum. |
| DISCRETE |
ON Semiconductor |
95% |
↑ |
↑ |
Allocation on SOD123 / SOT23 high
runners. Price increase expected Q3. |
| DISCRETE |
Vishay |
95% |
↑ |
↑ |
Lead Times 16 wks+ and increasing.
Unable to get confirmations. Price increases on small signal
expected Q3. |
| DISCRETE |
Taiwan Semi |
95% |
↑ |
↑ |
Lead Times 20 wks+. |
| DISCRETE |
STMicroelectronics |
95% |
↑ |
↑ |
Rectifiers, protection, Bipolar Lead
Times all moving out to 16 wks+. Focus discrete supplier to
Arrow. |
| DISCRETE |
Philips |
90%+ |
↑ |
↔ |
Lead Times increasing to 12-24 wks.
Philips are booked out for Q4; potential ALLOCATION. Global
demand at an all time high. |
| POWER |
Philips |
100% |
Allocation |
↔ |
Heavy allocation. Not confirming
orders until 2007. |
| |
STMicroelectronics |
95% |
↑ |
↑ |
Lead Times increasing to 16-22 wks+. |
| POWER |
Vishay |
95% |
↑ |
↑ |
Capacity constrained with severe
delinquencies. |
| POWER |
Fairchild |
95% |
↑ |
↑ |
Lead Times increased to 22-26 wks. FSC
booked out Q4. |
| OPTOCOUPLERS |
Fairchild |
90% |
↑ |
↑ |
Lead Times increasing and FSC booked
out through Q4. |
| OPTOCOUPLERS |
Sharp |
100% |
↔ |
↔ |
Off allocation; Lead Times 22 wks.
Excellent position on inventory and backlog. |
| OPTOCOUPLERS |
Toshiba |
95% |
↑ |
↔ |
High demand with extending Lead Times. |
| OPTOCOUPLERS |
Vishay |
90% |
↑ |
↔ |
High demand with extending Lead Times. |
| Supplier |
Technology |
FAB
Capacity |
Lead Time |
Price |
Comments |
| Atmel |
EEPROM (Serial) |
90% |
↔ |
↔ |
Serial EEPROM price stable, issues on
512k and extending Lead Times on 16K. |
| Atmel |
EEPROM (Parallel & Wireless) |
90% |
↔ |
↑ |
Price increase on Parallel. |
| Atmel |
EPROM |
85% |
↔ |
↔ |
Lead Times remain stable at between
ex-stock to 8 wks depending on density. |
| Atmel |
Flash |
90% |
↑ |
↔ |
Issues on 32Mb, 64Mb and 512k due to
die shrinks and increase orders from mobile phone
manufactures. |
| Cypress |
Slow SRAM |
100/90% |
Allocation |
↑ |
All older die revisions on allocation,
will continue for Q3. Once new die's released, old going
EOL. Shipping 4Mb uPower (CY6214xExx and CY62), 1 & 8Mb just
released, 2 & 16Mb Q3 and 256k Q2'07. New die rev Lead Times
~8-14 wks. |
| Cypress |
Fast SRAM |
100/90% |
Allocation |
↑ |
Allocation as with slow SRAM, new dies
64/256/512k, 1/2/4/8Mb releasing now, 16Mb Q4, only
exception 256k CY7C1399 Q2'07. New 5V pricing increased on
4Mb, 1Mb, 3V on both 1 & 4Mb. New die rev Lead Times ~8-14
wks. |
| IDT |
Fast SRAM |
95% |
↔ |
↔ |
8 to 16 wks. |
| Intel |
Flash |
100% |
Allocation |
↑ |
Issues with J3D support, 128Mb major
issues manual allocation, P30 should be now more than 16
wks. |
| Microchip |
EEPROM |
85% |
↔ |
↔ |
No major changes in price or
availability, Lead Time between 8-10 wks. |
| Micron |
SDRAM |
90% to 95% |
Allocation |
↑ |
128Mb still allocation, 64Mb announced
just joining. |
| Micron |
DDR I and DDR II |
90% to 95% |
↑ |
↑ |
|
| Micron |
NAND Flash |
100% |
↔ |
↔ |
Samples and pre-production volumes
only. |
| NEC |
SRAM |
90% to 95% |
↑ |
↑ |
|
| Renesas |
SRAM |
90% to 95% |
↑ |
↑ |
|
| Samsung |
Slow SRAM |
100% |
EOL |
↑ |
All K6X and 1 & 2Mb K6F on EOL, LTB
June, LTD October. All new orders quoting 10-12 mth Lead
Time, they are fully booked on EOL types and no short term
help seen. |
| Samsung |
Fast SRAM |
95% |
↑ |
↑ |
4Mb IndTemp still ok, full
production. 1Mb all and 4Mb Com-temp discontinued,
causing supply issues for the rest of the market. SyncSRAM
are 12-20 wks Lead Time, RoHS still limited availability. |
| Samsung |
SDRAM |
90% |
↔ |
↔ |
Average Lead Time 4-6 wks. |
| Samsung |
DDR I and DDR II |
90% |
↔ |
↔ |
256 & 512Mb average Lead Time 4-6 wks,
1Gb 8-10 wks. |
| Samsung |
NOR Flash |
90% |
↔ |
↔ |
|
| Samsung |
NAND Flash |
85% |
↔ |
↔ |
None left on allocation, rest on
average 7-9 wks. Pricing stable, some densities with minor
decrease. |
| Sharp |
SRAM (64k Only) |
90% to 95% |
EOL |
↑ |
On EOL now. |
| Sharp |
Flash |
95% |
↔ |
↑ |
Lead Time currently 24 wks+. Only
supporting 3V parts. 5V EOL Dec'05. |
| Spansion |
Flash |
90%+ |
↑ |
↑ |
Now acknowledging all PLCC parts for
delivery on new orders November, 5V parts Lead Time
increasing due to automotive OEM customer demand. 64Mb now
on 20 wks. Predict allocation by end of September. |
| STMicroelectronics |
EEPROM |
85% |
↑ |
↔ |
Lead Times now 18 wks for new orders. |
| STMicroelectronics |
EPROM |
85% |
↔ |
↔ |
No real changes in supply or price in
recent quarters. |
| STMicroelectronics |
NOR Flash |
90% |
↑ |
↑ |
64Mb on 16 wks, price increases in Q3
Lead Times extending. |
| STMicroelectronics |
NAND Flash |
90% |
↔ |
↓ |
Focus on 128Mb, 256Mb and 512Mb. Joint
venture with Hynix. New for distibution customers. |
| Toshiba |
SRAM |
90% |
Obsolete |
↑ |
All SRAMs which were left are EOL'd. |
| Toshiba |
NOR Flash |
90% |
↑ |
↑ |
|
| Toshiba |
NAND Flash |
100% |
Allocation |
↓ |
Parts in short supply, EOL on 64Mb and
128Mb. Price trends dependant on density |
Semiconductors - Proprietary
|
| Supplier |
Technology |
FAB
Capacity |
Lead Time |
Price |
Comments |
| Analog
Devices |
Analogue |
n/a |
↑ |
↔ |
Yield issues on some specific Part
Numbers. Lead Times typically 12-16 wks overall. Some parts
on formal allocation. |
| Analog
Devices |
DSP |
|
↑ |
↔ |
Yield issues on some specific Part
Numbers. Lead Times typically 12-16 wks overall. Some parts
on formal allocation. |
| Altera |
FPGA |
100% |
Allocation |
↔ |
Capacity problem at TSMC. Allocation
should be over early Q3 '06. |
| Atmel |
AVR-Micro's, (ATMEGA, ATTINY) |
90% |
↑ |
↔ |
18-20 wks, due to capacity problem
with test and assembly. Atmel moved their testing from San
Jose facility to Taiwan. Should be stabilised mid Q2 '06. |
| Cypress |
Low speed USB |
90% - 95% |
↑ |
↑ |
Lead Times 13-16 wks. Current
projection is Lead Times will stabilise in Q3 '06. |
| Cypress |
HOTLinkII (parts beginning CYP, CYV,
CYW) |
100% |
↑ |
↔ |
Lead Time appr. 18-20 wks. Other
suppliers stopped producing these products and therefore
ramp up at Cypress. Estimation for extended delivery to
remain until end of Q3 '06. |
| Cypress |
Low speed USB |
90% - 95% |
↑ |
↑ |
Lead Times 13-16 wks. Current
projection is Lead Times will stabilise in Q3 '06. |
| Freescale |
16-bit Micros with embedded flash |
100% |
Allocation |
↔ |
Allocation due to manufacturing
problem related to their partner TSMC3. Allocation should be
over by end Q3 '06. Generally all Freescale Lead Times are
extended. Major impact into Automotive applications |
| IR |
Power |
90% + |
↑ |
↑ |
Capacity problems on DPAK Packaging. |
| LTC |
Data Converters |
n/a |
↔ |
↔ |
Lead Times typically 4 wks |
| LTC |
Amplifiers / Comparators |
n/a |
↔ |
↔ |
Lead Times typically 4 wks. |
| LTC |
Power Management |
n/a |
↔ |
↔ |
Lead Times typically 4 wks |
| LTC |
Interface |
n/a |
↔ |
↔ |
Lead Times typically 4 wks. |
| Micrel |
Ethernet (KSx) High Bandwidth (SYx) |
95% |
↔ |
↔ |
Off Allocation, Lead Times 18-24 wks. |
| STMicroelectronics |
Regulator: Ppak and D2pak |
100% |
Allocation |
↑ |
Allocation. |
| STMicroelectronics |
Interface: SO16 packages. |
100% |
Allocation |
↑ |
ST operating almost on full capacity.
Mainly driven by AsiaPac market. Also capacity problem in
test & assembly. |
| STMicroelectronics |
Linear: MiniSO, SO14 and SO8 |
100% |
Allocation |
↑ |
ST operating almost on full capacity.
Mainly driven by AsiaPac market. Also capacity problem in
test & assembly. |
Texas
Instruments |
High Performance Analogue INAx, OPAx,
Ucx |
90% + |
↑ |
↔ |
Test capacity & qualifying issues. |
Texas
Instruments |
TMS320 - DSP's |
90% + |
↑ |
↔ |
Test capacity issues. |
Texas
Instruments |
MSP430 - Micro's |
100% |
↑ |
↔ |
Contamination of wafers at FAB (TSMC)
- all scrapped & re-started - some backlog now re-confirmed
to Sept '06. |
| Supplier |
Technology |
FAB
Capacity |
Lead Time |
Price |
Comments |
| Sharp |
Displays |
100% |
Allocation |
↔ |
Extended Lead Times between 22-26 wks. |
| All |
Displays |
80% - 90% |
↑ |
↔ |
General Lead Times between 12-16 wks
on Far East suppliers. ROHS conversion slow. |
| Product |
Package |
Current
Lead Time |
Lead Time |
Price |
Comments |
| Ceramic
Capacitors |
Surface Mount |
12 wks |
↔ |
↔ |
|
| Ceramic
Capacitors |
Leaded |
10 wks |
↔ |
↔ |
|
| Tantalum
Capacitors |
Surface Mount |
9 wks |
↔ |
↔ |
|
| Tantalum
Capacitors |
Leaded |
12 wks |
↔ |
↔ |
|
| Film
Capacitors |
Box |
11 wks |
↔ |
↔ |
|
| Electrolytic Capacitors |
Small Can |
13 wks |
↔ |
↔ |
|
| Electrolytic Capacitors |
Large Can |
13 wks |
↔ |
↔ |
|
| Resistors |
Surface Mount |
12-15 wks |
↑ |
↔ |
Yageo PR/PF,RC0805,RC1206 Lead Times
increase to 15 wks. |
| Resistors |
Surface Mount - Phycomp |
Allocation |
↔ |
↔ |
Forecasted to be off Allocation end Q3
'06 |
| Resistors |
Leaded |
10 wks |
↔ |
↔ |
Vishay price increases |
| Inductors |
|
10-16 wks |
↔ |
↔ |
|
| Crystals |
Surface Mount |
10 wks |
↔ |
↔ |
Significant Lead Time issues with
Raltron. Cross reference to TXC or CMAC. |
| Crystals |
Leaded |
9 wks |
↔ |
↔ |
Significant Lead Time issues with
Raltron. Cross reference to TXC or CMAC. |
| Fuses |
Standard |
12 wks |
↔ |
↔ |
|
| Fuses |
Surface Mount |
10 wks |
↔ |
↔ |
|
| Fuses |
Resettable |
9 wks |
↔ |
↔ |
|
PEMCO - Electro-Mechanical
|
| Supplier |
Technology |
Lead
Time Trend |
Price
Trend |
Comments |
| Omron |
General purpose Relays /Signal /
Telecom |
↔ |
↔ |
General purpose Relays /Signal /
Telecom / 16 wks (may have stock at Omron). |
| Tyco |
General purpose Relays /Signal /
Telecom |
↔ |
↑ |
General purpose Relays 8-12 wks.
Signal and Telecom 6-18 wks. |
| Knitter-switch |
DIL switches / Lever /Toggle /Tactile/
Pushbutton |
↔ |
↔ |
DIL switches 6-7 wks. Lever / Toggle
6-14 wks. Tactile 6-8 wks. Pushbutton 6-14 wks. |
| ITT Cannon |
DIL switches / Lever /Toggle /Tactile/
Pushbutton |
↑ |
↑ |
DIL switches 7-14 wks. Lever / Toggle
6-15 wks. Tactile 6-8 wks. Pushbutton 6-18 wks *ROHS issues,
not all parts available. Price increase in April 4-6%. |
| Supplier |
Technology |
Lead Time
Trend |
Price
Trend |
Comments |
| 3M |
Headers, IDC, Cable/B-Board, Sockets |
↔ |
↑ |
Headers 3-8 wks. IDC 8-14 wks.
Cable/B-Board 6-12 wks. Sockets 8 wks. |
| Samtec |
Headers, IDC, Cable/B-Board, Sockets |
↑ |
↑ |
All products are high demand with
capacity issues. |
| Tyco |
Headers, IDC, Cable/B-Board, Sockets |
↔ |
↑ |
Headers 9-18 wks. IDC 9-18 wks.
Cable/B-Board 9-20 wks. Sockets 12-22 wks. Another Price
Increase approx 5% 01/07/06. |
| Molex |
Headers, IDC, Cable/B-Board, Sockets |
↑ |
↔ |
Headers 10-14 wks. IDC 7-15 wks.
Cable/B-Board 11-16 wks. Sockets 8 wks. Lead Times extending
but no 'official' change by Molex. |
| FCI |
Headers, IDC, Cable/B-Board, Sockets |
↔ |
↑ |
Headers 9-12 wks. IDC 10 wks.
Cable/B-Board 8-12 wks. Sockets 10 wks. Price increased
between 2-6% in May 06. |
| FCI |
I/O, Modular, D-Sub |
↔ |
↑ |
I/O 5-14 wks. D-Sub 10-14 wks. |
| Molex |
I/O, Modular, D-Sub |
↑ |
↔ |
I/O 5-12 wks. D-Sub 5-10 wks. |
| Samtec |
I/O, Modular, D-Sub |
↔ |
↔ |
All products are high demand with
capacity issues. |
| Tyco |
Power, Terminal Blocks, Industrial |
↔ |
↑ |
Power 7-19 wks. Terminal blocks 9-20
wks. Industrial 7-16 wks. |
| Tyco |
RF Connectors |
↔ |
↑ |
18-20 wks. |
| Supplier |
Technology |
Lead Time
Trend |
Price
Trend |
Comments |
| Astec |
Power supplies /DC-DC Converters |
↔ |
↔ |
15-17 wks Lead Time. |
C&D
Technologies |
Power supplies /DC-DC Converters |
↑ |
↔ |
9-18 wks extending. ROHS parts now
available. |
|
January 2005
Semiconductors
Micro -
Standard lead-time approx. 16 weeks.
Renesas - 16 Bit Micro ON ALLOCATION. TI offer a 2 week delivery
Memory -
Standard lead-time approx. 26 weeks.
Maxim & STM – 14/16 weeks. BEWARE – Some STM is ON ALLOCATION
Commodity Lin & Logic -
Maxim & Rohm – 14 weeks +.
BEWARE – Some STM is ON ALLOCATION. Standard Lead-time approx. 4-8 weeks
Non-Commodity Lin & Logic -
Standard Lin & Logic between 12-16 weeks.
FSC can be as long as 20 weeks
Discretes -
Infineon & STM are best at approx. 10 weeks.
FSC not good at 20 + weeks. All the rest 12-16 weeks
Passives
Electrolytics -
Standard lead-time approx. 12-14 weeks.
Epcos best of the bunch at only 10 weeks
Tantalums -
Lead-times all over the place on Tants with variants from 5-26 weeks.
AVX at 5-7 weeks. Vishay at 10-19 weeks. Arcotronics at 26 weeks
Cap Ceramics
-
Again Big variations on
lead-time (Range from 6-26 weeks) Kemet & Epcos at only 6-8 weeks.
Arcotronics at 26 weeks.
The rest sit at around 12-16 weeks
Inductors
- Lead-times approx. 10-12 weeks.
AVX & TDK at only 9 weeks. Tyco at 14 weeks
Fuses -
Bourns resettable fuses at 9 weeks.
Littelfuse at 14 weeks
Resistors -
Standard lead-time approx. 10 weeks.
Rohm at only 8-9 weeks
Emech
D Type -
Average lead-time is at approx. 8 weeks.
Schurter can offer as low as 4 weeks
Pin Headers -
3M can offer 4 weeks. Average
lead-time is approx. 8 weeks
Switches & Relays -
Crydom at 6 weeks. Omron at 16
weeks. Average lead-time 10-14 weeks
Cable -
Lead-times vary from 3-10 weeks.
3M at 3 weeks. Hirose & Tyco out at 8-10 weeks
Fans
- All Fans available on 10-12 week lead-time
November 2004
Semiconductors
Micro -
Standard lead-time approx. 16 weeks. Renesas - 16 Bit Micro ON
ALLOCATION
Memory -
OKI at 26 weeks. Some ST & Toshiba ON ALLOCATION. ALL Renesas SRAM’s ON
ALLOCATION.
Commodity Lin & Logic -
Texas Inst. - 3 weeks. Infineon &
NSC - 8 weeks. Fairchild & Rohm - 12 weeks +. BEWARE - Some STM is ON
ALLOCATION. Standard Lin & Logic between 12-16 weeks
Non- Commodity Lin & Logic
- Lead-time ranges from 12-16
weeks. National ahead of the rest at only 8 weeks.
Discretes -
Standard lead-time approx. 12 weeks.
Fairchild currently at around 20 weeks
Passives
Electrolytics -
Standard lead-time approx. 14-16 weeks.
BHC at 8-12 weeks. Epcos at 10 weeks.
Tantalums -
Lead-times all over the place on Tants with variants
from 5-26 weeks. AVX at 5-7 weeks
Epcos, Kemet & Rohm at approx. 10 week. Vishay at 19 weeks and
Arcotronics at 26 weeks.
Inductors -
Lead-times approx. 10 weeks.
Tyco currently at 14 weeks
Resistors -
Standard lead-time approx. 10 weeks.
Bourns at 14 weeks. Tyco ranges from 8-16 weeks
Cap Ceramics -
Again big variations on lead-time (from 6-26weeks)
Kemet at 6-8 weeks AVX, Epcos & Panasonic at around 12 weeks Murata,
Rubycon & TDK at around 16 weeks. Arcotronics at 26 weeks.
Emech
Most Product Types running with a lead-time of around 8
weeks Some Exceptions: Omron at 16 weeks Tyco & Hypertac up to 14 weeks.
Batteries and Cable Product available in around 6 weeks, except for
Hirose & Tyco at 8-10 weeks
March 2004
Jan 2004
Allocation and shortages will hit in
early 2004
Microchip..
A letter from the president
The electronics industry is currently experiencing some
growing pains.
Increased demand for consumer electronics, PCs and telecom equipment has
driven significant growth in
global demand for electronic components through the second half of 2003,
and into 2004. Although the UK market has not benefited directly from
this growth as much of this type of equipment is now manufactured
abroad, we are of course still part of and subject to global market
shifts, and resulting trading conditions.
The fundamental issue the industry faces currently is a lack of test and
assembly (or "back end") capacity. This lack of capacity has led to a
number of product types going on extended lead time and allocation in
the past 2weeks.
Semiconductor manufacturers are having to buy additional capacity at a
cost which has led to SIGNIFICANT PRICE INCREASES.
In particular we have seen price increases from the following suppliers
National - up to 100% price increase on selected commodity linear parts.
Texas - up to 50% price increase on selected commodity linear parts
Infineon - up to 10% price increases on selected discrete parts
Fairchild - up to 15% price increases on selected discrete parts
STM - have not increased prices on allocation parts as yet, but it seems
likely that they will have to increase when they renew their Master
Quote in April.
We can protect ourselves against increasing lead times by
placing extended orders on our suppliers, but there is little we can do
to protect ourselves against price increases.
Please note that some of these price increases will start
to impact us in March as new stock comes in at higher prices. Our
operations and marketing teams are currently running price checking
reports, and trying to negotiate better pricing on affected parts to
support contract customers.
At the minute the number of parts affected by this is in
the low 100's, however, if history is anything to go by, then the knock
on effect is that the number of parts affected will increase
dramatically.
Visitor No Sept 06 :
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